Semiconductor device

ABSTRACT

A semiconductor device includes a supporting board having a protection film thereon; a semiconductor chip provided on the supporting board; a first internal connecting terminal formed on the supporting board; a second internal connecting terminal formed on the semiconductor chip; a first insulation layer for covering an upper surface of the supporting board and upper and lateral surfaces of the semiconductor chip; a wiring pattern provided on the first insulation layer, the wiring pattern connecting the first and second internal connecting terminals; a solder resist layer provided on the first insulation layer and the wiring pattern, the solder resist layer having an opening part; an external connecting terminal provided so as to connect to the wiring pattern through the opening part; a groove part formed on outer peripheries of the supporting board, the protection film, and the first insulation layer; and a resin layer formed in the groove part.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. patent application Ser. No.12/892,993, filed on Sep. 29, 2010 now U.S. Pat. No. 8,008,123, which isbased upon and claims the benefit of priority of Japanese PatentApplication No. 2009-287903 filed on Dec. 18, 2009, the entire contentsof which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to semiconductor devices. Morespecifically, the present invention relates to a semiconductor devicewhere a wiring pattern is formed on a semiconductor chip.

2. Description of the Related Art

In recent years, miniaturization, reducing thickness, and reducingweight of semiconductor application products have been drasticallyprogressing for use of digital cameras and various mobile devices suchas mobile phones. Because of this, for example, miniaturization and highdensity are required for a semiconductor device such as NAND type flashmemory. A semiconductor device as illustrated in FIG. 1, a so-called CSP(chip size package), for example, has been suggested. The CSP has asubstantially same configuration, in planar view, as a semiconductorchip. In addition, a low manufacturing cost, as well as miniaturizationand high density, is strongly required in such a semiconductor device.

Here, a related art semiconductor device and its manufacturing methodare discussed with reference to FIG. 1 through FIG. 11. FIG. 1 is across-sectional view of an example of the related art semiconductordevice. As illustrated in FIG. 1, a related art semiconductor device 100includes a semiconductor chip 101, internal connecting terminals 102, aninsulation layer 103, wiring patterns 104, solder resist 106, andexternal connecting terminals 107.

The semiconductor chip 101 includes a thin plate-shaped semiconductorsubstrate 109, a semiconductor integrated circuit 111, plural electrodepads 112, and a protection film 113. The semiconductor substrate 109 isformed by, for example, cutting a thin plate-shaped Si wafer intopieces.

The semiconductor integrated circuit 111 is provided on a surface of thesemiconductor substrate 109. The semiconductor integrated circuit 111 isformed of a diffusion layer, an insulation layer, a via, wiring andother parts (not illustrated in FIG. 1). The plural electrode pads 112are provided on the semiconductor integrated circuit 111, and areelectrically connected to wirings provided at the semiconductorintegrated circuit 111. The protection film 113 is provided on thesemiconductor integrated circuit 111. The protection film 113 isconfigured to protect the semiconductor integrated circuit 111.

The internal connecting terminals 102 are provided on the electrode pads112. Upper end parts of the internal connecting terminals 102 areexposed from the insulation layer 103 so as to be connected to thewiring patterns 104. The insulation layer 103 is provided so as to covera surface of the semiconductor chip 101 where the internal connectingterminals 102 are provided. As the insulation layer 103, for example,sheet insulation resin having adhesive properties such as NCF(Non-Conductive Film) or the like can be used.

The wiring patterns 104, which may be so-called re-wirings, are providedso that positions of the electrode pads 112 are different from positionsof the external connecting terminals 107. In other words, a so-calledfan-in structure for pitch conversion is formed. The wiring patterns 104are provided on the insulation layer 103. The wiring patterns 104 areconnected to the internal connecting terminals 102. The wiring patterns104 are electrically connected to the electrode pads 112 via theinternal connecting terminals 102. The wiring patterns 104 have externalconnecting terminal providing areas 104A where the external connectingterminals 107 are provided. The solder resist 106 is provided on theinsulation layer 103 so as to cover the wiring patterns 104 other thanthe external connecting terminal providing areas 104A.

The external connecting terminals 107 are provided in the externalconnecting terminal providing areas 104A of the wiring patterns 104. Theexternal connecting terminals 107 are connected to the wiring patterns104. As materials of the external connecting terminals 107, for example,an alloy including Pb, an alloy of Sn and Cu, an alloy of Sn and Ag, analloy of Sn, Ag, and Cu, and other metals and alloys can be used.

FIG. 2 is a plan view of an example of a semiconductor substrate onwhich is formed the related art semiconductor device. In FIG. 2, anumerical reference 110 denotes a semiconductor substrate. In FIG. 2,“C” represents a position (hereinafter “cutting position C”) where thesemiconductor substrate 110 is cut by a dicer. As illustrated in FIG. 2,the semiconductor substrate 110 includes plural semiconductor deviceforming areas A and scribing areas B where the semiconductor deviceforming areas A are separated from each other. The semiconductor deviceforming areas A are where the semiconductor devices 100 are formed. Bymaking the semiconductor substrate 110 have a thin plate-shapeconfiguration and cutting at the cutting positions C, the semiconductorsubstrates 109 discussed with reference to FIG. 1 are formed.

FIG. 3 through FIG. 11 are first through ninth views showing an exampleof a manufacturing process of the related art semiconductor device. InFIG. 3 through FIG. 11, parts that are the same as the parts of therelated art semiconductor device 100 illustrated in FIG. 1 are given thesame reference numerals, and explanation thereof may be omitted. In FIG.3 through FIG. 11, “A” denotes a semiconductor device forming area(hereinafter “semiconductor device forming area A”). “B” denotes ascribing area B where the semiconductor device forming areas A areseparated from each other (hereinafter “scribing area B”). “C” denotes aposition (hereinafter “cutting position C”) where the semiconductorsubstrate 110 is cut by a dicer.

First, in a step illustrated in FIG. 3, a semiconductor chip 101 havingthe semiconductor integrated circuit 111, plural electrode pads 112, andthe protection film 113 is formed at a surface of the semiconductorsubstrate 111 which is not yet made to have a thin plate-shapedconfiguration. Next, in a step illustrated in FIG. 4, the internalconnecting terminals 102 are formed on the electrode pads 112. In thisstep, there is unevenness of the heights of the plural internalconnecting terminals 102.

Next, in a step illustrated in FIG. 5, a flat plate 115 is pressed ontothe plural internal connecting terminals 102 so that the heights of theinternal connecting terminals 102 are made even. In other words, aleveling process is performed. Next, in a step illustrated in FIG. 6,the insulation layer 103 made of resin is formed so as to cover theinternal connecting terminals 102 and the surface of the semiconductorchip 101 where the internal connecting terminals 102 are formed. As theinsulation layer 103, for example, the sheet insulation resin having theadhesive properties such as the NCF (Non-Conductive Film) or the likecan be used.

Next, in a step illustrated in FIG. 7, the insulation layer 103 isground until surfaces 102A of the internal connecting terminals 102 areexposed from the insulation layer 103. At this time, the grinding isperformed so that a surface 103A of the insulation layer 103 is madeflush with the surfaces 102A of the internal connecting terminals 102.As a result of this, a surface of a structural body illustrated in FIG.7 (more specifically, the surface 103A of the insulation layer 103 andthe surfaces 102A of the internal connecting terminals 102) becomesflat.

Next, in a step illustrated in FIG. 8, the wiring patterns 104 areformed on the flat surface of the structural body illustrated in FIG. 7.More specifically, for example, a metal foil (not illustrated in FIG. 8)is adhered to the structural body illustrated in FIG. 7. Then, resist(not illustrated in FIG. 8) is applied so as to cover the metal foil.Then, by exposing and developing the resist, a resist film (notillustrated in FIG. 8) is formed on the metal foil of a portioncorresponding to a forming area of the wiring patterns 104. After that,the metal foil is etched by using the resist film as a mask so that thewiring patterns 104 are formed (subtractive method). Then, the resistfilm is removed.

Next, in a step illustrated in FIG. 9, the solder resist 106 is formedon the insulation layer 103 so as to cover the wiring patterns 104situated at a portion other than the external connecting terminalproviding areas 104A. Next, in a step illustrated in FIG. 10, thesemiconductor substrate 110 is ground from a rear surface side of thesemiconductor substrate 110 so that the thin plate-shaped configurationof the semiconductor substrate 110 is made. Next, in a step illustratedin FIG. 11, the external connecting terminals 107 are formed on theexternal connecting terminal providing areas 104A. Solder bumps, forexample, can be used as the external connecting terminals 107. Asmaterials of the external connecting terminals 107, for example, analloy including Pb, an alloy of Sn and Cu, an alloy of Sn and Ag, analloy of Sn, Ag, and Cu, and other metals and alloys can be used. Afterthat, parts of the semiconductor substrate 110 are cut at the cuttingpositions C so that plural semiconductor devices 100 are manufactured.

Thus, according to the related art semiconductor device (chip sizepackage), since the external connecting terminals should be formed onthe chip size package, only a so-called a fan-in structure should beapplied. See, for example, Japanese Patent Application Publication No.2001-298149 and Japanese Patent Application Publication No. 2001-217381.

However, as a large number of pins are provided in the semiconductordevice, it may become more difficult to arrange re-wirings and thereforea so-called fan-out structure may be required.

SUMMARY OF THE INVENTION

Accordingly, embodiments of the present invention may provide a noveland useful semiconductor device solving one or more of the problemsdiscussed above.

More specifically, the embodiments of the present invention may providea semiconductor device having the so-called fan-out structure.

According to one aspect of the present invention, a semiconductor deviceincludes a supporting board having a protection film thereon; asemiconductor chip provided on the supporting board; a first internalconnecting terminal formed on the supporting board; a second internalconnecting terminal formed on the semiconductor chip; a first insulationlayer provided so as to cover an upper surface of the supporting boardand upper and lateral surfaces of the semiconductor chip; a wiringpattern provided on the first insulation layer, said wiring patternconnecting the first and second internal connecting terminals; a solderresist layer provided on the first insulation layer and the wiringpattern, said solder resist layer having an opening part; an externalconnecting terminal provided so as to connect to the wiring patternthrough the opening part; a groove part formed on outer peripheries ofthe supporting board, the protection film, and the first insulationlayer; and a resin layer formed in the groove part.

Additional objects and advantages of the embodiments are set forth inpart in the description which follows, and in part will become obviousfrom the description, or may be learned by practice of the invention.The object and advantages of the invention will be realized and attainedby means of the elements and combinations particularly pointed out inthe appended claims. It is to be understood that both the foregoinggeneral description and the following detailed description are exemplaryand explanatory and are not restrictive of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an example of a related artsemiconductor device;

FIG. 2 is a plan view of an example of a semiconductor substrate formingthe related art semiconductor device;

FIG. 3 is a first view showing an example of a manufacturing process ofthe related art semiconductor device;

FIG. 4 is a second view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 5 is a third view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 6 is a fourth view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 7 is a fifth view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 8 is a sixth view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 9 is a seventh view showing the example of the manufacturingprocess of the related art semiconductor device;

FIG. 10 is an eighth view showing the example of the manufacturingprocess of the related art semiconductor device;

FIG. 11 is a ninth view showing the example of the manufacturing processof the related art semiconductor device;

FIG. 12 is a cross-sectional view of an example of a semiconductordevice of a first embodiment of the present invention;

FIG. 13 is a first view showing an example of a manufacturing process ofthe semiconductor device of the first embodiment of the presentinvention;

FIG. 14 is a second view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 15 is a third view showing the example of the manufacturing processof the semiconductor device of the first embodiment of the presentinvention;

FIG. 16 is a fourth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 17 is a fifth view showing the example of the manufacturing processof the semiconductor device of the first embodiment of the presentinvention;

FIG. 18 is a sixth view showing the example of the manufacturing processof the semiconductor device of the first embodiment of the presentinvention;

FIG. 19 is a seventh view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 20 is an eighth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 21 is a ninth view showing the example of the manufacturing processof the semiconductor device of the first embodiment of the presentinvention;

FIG. 22 is a tenth view showing the example of the manufacturing processof the semiconductor device of the first embodiment of the presentinvention;

FIG. 23 is an eleventh view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 24 is a twelfth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 25 is a thirteenth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 26 is a fourteenth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 27 is a fifteenth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 28 is a sixteenth view showing the example of the manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention;

FIG. 29 is a cross-sectional view of an example of a semiconductordevice of a second embodiment of the present invention;

FIG. 30 is a first view showing an example of a manufacturing process ofthe semiconductor device of the second embodiment of the presentinvention;

FIG. 31 is a second view showing the example of the manufacturingprocess of the semiconductor device of the second embodiment of thepresent invention;

FIG. 32 is a third view showing the example of the manufacturing processof the semiconductor device of the second embodiment of the presentinvention;

FIG. 33 is a fourth view showing the example of the manufacturingprocess of the semiconductor device of the second embodiment of thepresent invention;

FIG. 34 is a fifth view showing the example of the manufacturing processof the semiconductor device of the second embodiment of the presentinvention;

FIG. 35 is a sixth view showing the example of the manufacturing processof the semiconductor device of the second embodiment of the presentinvention;

FIG. 36 is a first view showing an example of a manufacturing process ofthe semiconductor device of the third embodiment of the presentinvention;

FIG. 37 is a second view showing the example of the manufacturingprocess of the semiconductor device of the third embodiment of thepresent invention; and

FIG. 38 is a third view showing the example of the manufacturing processof the semiconductor device of the third embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A description is given below, with reference to the FIG. 12 through FIG.38 of embodiments of the present invention.

First Embodiment

FIG. 12 is a cross-sectional view of an example of a semiconductordevice of a first embodiment of the present invention. As shown in FIG.12, a semiconductor device 10 includes a semiconductor chip 11, firstinternal connecting terminals 15, a fixing layer 13, a supporting board14, second internal connecting terminals 12, an insulation layer 16, awiring pattern 17 including a first metal layer 28 and a second metallayer 29, solder resist 18, and external connecting terminals 19.

As shown in FIG. 12, the semiconductor chip 11 is fixed on thesupporting board 14 via the fixing layer 13. The semiconductor chip 11includes a semiconductor substrate 21, a semiconductor integratedcircuit 22, plural electrode pads 23, and a protection film 24. Thesemiconductor integrated circuit 22 is formed at the semiconductorsubstrate 21. The semiconductor substrate 21 has a thin-plate shapeconfiguration. The thickness T₁ of the semiconductor substrate 21including the thickness of the semiconductor integrated circuit 22 canbe, for example, approximately 50 μm through approximately 100 μm. Thesemiconductor substrate 21 is formed by, for example, cutting the Siwafer having a thin plate shape configuration into pieces.

The semiconductor integrated circuit 22 is provided at a surface of thesemiconductor substrate 21. The semiconductor integrated circuit 22includes a diffusion layer (not illustrated in FIG. 12) formed on thesemiconductor substrate 21, an insulation layer (not illustrated in FIG.12) formed on the semiconductor substrate 21, wiring (not illustrated inFIG. 12) and a via hole (not illustrated in FIG. 12) in stackedinsulation layers, and other parts. In the following explanation, asurface where the semiconductor integrated circuit 22 of thesemiconductor chip 11 is formed may be called a main surface.

The plural electrode pads 23 are provided on the semiconductorintegrated circuit 22. The electrode pads 23 are electrically connectedto the wiring (not illustrated in FIG. 12) provided on the semiconductorintegrated circuit 22. As a material of the electrode pad 23, forexample, Al or the like can be used. As the material of the electrodepad 23, a material where an Al layer is formed on a Cu layer, a materialwhere an Al layer is formed on a Si layer formed on a Cu layer or thelike may be used.

The protection film 24 is provided on the surface of the semiconductorsubstrate 21 and on the semiconductor integrated circuit 22. Theprotection film 24 is configured to protect the semiconductor integratedcircuit 22 and may be called a passivation film. As the protection film24, for example, an SiN film, a PSG film, or the like can be used. Inaddition, a polyimide film or the like may be further stacked on the SiNfilm, the PSG film, or the like.

The second internal connecting terminal 12 is provided on the electrodepad 23 of the semiconductor chip 11. The second internal connectingterminal 12 is configured to electrically connect the semiconductorintegrated circuit 22 of the semiconductor chip 11 and the wiringpattern 17 to each other. The height H₁ of the second internalconnecting terminal 12 can be, for example, approximately 20 μm throughapproximately 50 μm. A surface of the second internal connectingterminal 12 facing the electrode pad 23 can have, for example, asubstantially circular-shaped configuration. A diameter of thesubstantially circular-shaped configuration may be, for example,approximately 40 μm through approximately 70 μm.

As the second internal connecting terminal 12, for example, an Au bump,a Cu bump, an Au plating film, a metal film formed of a Ni film formedby an electroless plating method and an Au film covering the Ni film, orthe like can be used. The Au bump or the Cu bump can be formed by abonding wire by using, for example, a wire bonding apparatus. Inaddition, the Au bump or the Cu bump can be formed by using a platingmethod.

The fixing layer 13 is provided so as to fix the semiconductor chip 11and the supporting board 14 to each other.

As long as the semiconductor chip 11 and the supporting board 14 can befixed to each other, any material can be used as a material of thefixing layer 13. As the material of the fixing layer 13, for example, adouble-faced pressure-sensitive adhesive tape such as a die attach filmcan be used. In addition, instead of the double-faced pressure-sensitiveadhesive tape such as the die attaché film, an adhesive or the likehaving electrical insulation may be used. The thickness of the fixinglayer 13 can be, for example, approximately 10 μm.

The supporting board 14 includes a semiconductor substrate 25, anelectrode pad 26, and a protection film 27. The semiconductor substrate25 has a thin-plate-shaped configuration. The thickness T₂ of thesemiconductor substrate 25 can be, for example, approximately 200 μmthrough approximately 500 μm. The semiconductor substrate 25 is formedby, for example, cutting the Si wafer having a thin plate-shapedconfiguration into pieces. In the following explanation, a surface at anelectrode pad 26 side of the supporting board 14 may be called a mainsurface. The semiconductor substrate 25 of the supporting board 14 mayhave a semiconductor integrated circuit.

The first internal connecting terminal 15 is provided on the electrodepad 26 of the supporting board 14. The first internal connectingterminal 15 is provided so as to form the so-called fan-out structure sothat the external connecting terminal 19 is provided outside thesemiconductor chip 11 as shown in FIG. 12. The height H₂ of the firstinternal connecting terminal 15 can be, for example, approximately 80 μmthrough approximately 160 μm. A surface of the first internal connectingterminal 15 facing the electrode pad 26 can have, for example, asubstantially circular-shaped configuration. A diameter of thesubstantially circular-shaped configuration may be, for example,approximately 100 μm through approximately 150 μm.

As the first internal connecting terminal 15, for example, an Au bump, aCu bump, an Au plating film, a metal film formed by a Ni film formed byan electroless plating method and an Au film covering the Ni film, orthe like can be used. The Au bump or the Cu bump can be formed by abonding wire by using, for example, a wire bonding apparatus. Inaddition, the Au bump or the Cu bump can be formed by using a platingmethod.

The insulation layer 16 is formed on the supporting board 14 so as tocover the semiconductor chip 11, the first internal connecting terminal15, and the second internal connecting terminal 12. A surface 15A of thefirst internal connecting terminal 15 and a surface 12A of the secondinternal connecting terminal 12 are exposed from (through) a surface 16Aof the insulation layer 16. The surface 16A of the insulation layer 16is flush with a surface 15A of the first internal connecting terminal 15and a surface 12A of the second internal connecting terminal 12. Theinsulation layer 16 is configured to protect the main surface (circuitforming surface) of the semiconductor chip 11 by sealing and is a basemember when the wiring pattern is formed. The thickness T₃ of theinsulation layer 16 can be, for example, approximately 80 μm throughapproximately 160 μm.

As a material of the insulation layer 16, for example, insulation resinsuch as epoxy group resin or polyimide group resin, a built-up resinsuch as epoxy resin including inorganic filler or epoxy resin excludingthe inorganic filler, a liquid crystal polymer, or the like can be used.

The first internal connecting terminal 15 and the second internalconnecting terminal 12 are covered with only the insulation layer 16.With this structure, it is possible to prevent a partial stress frombeing applied to the first internal connecting terminal 15 and thesecond internal connecting terminal 12. Hence, it is possible to preventcracks from being generated at the first internal connecting terminal 15and the second internal connecting terminal 12. In other words, if thefirst internal connecting terminal 15 and the second internal connectingterminal 12 come in contact with plural insulation layers, based ondifferences of physical properties (coefficient of thermal expansion,modulus of elasticity, or the like) of the plural insulation layers, thepartial stress may be applied, due to temperature change or the like, toa portion where the first internal connecting terminal 15 and the secondinternal connecting terminal 12 come in contact with plural insulationlayers. As a result of this, the cracks may be generated at the firstinternal connecting terminal 15 and the second internal connectingterminal 12. By forming a structure where the first internal connectingterminal 15 and the second internal connecting terminal 12 come incontact with a single insulation layer 16, it is possible to preventcracks from being generated at the first internal connecting terminal 15and the second internal connecting terminal 12.

The wiring patterns 17, which may be the so-called re-wirings, areprovided so that positions of the electrode pads 23 are different from aposition of the external connecting terminals 19. In other words, theso-called fan-out structure is formed. The wiring pattern 17 includesthe first metal layer 28 and the second metal layer 29. As the firstmetal layer 28, a layered product where, for example, a Ti film and a Cufilm are stacked in this order, a layered product where a Cr film and aCu film are stacked in this order, a single layer structural body of aCu film, or the like can be used. As a material of the second metallayer 29, for example, Cu or the like can be used.

The wiring pattern 17 is provided on the surface 16A of the insulationlayer 16. A part of the wiring pattern 17 comes in contact with thesurface 15A of the first internal connecting terminal 15 and the surface12A of the second internal connecting terminal 12 so as to contribute torealization of the so-called fan-out structure. The wiring pattern 17 iselectrically connected to the semiconductor integrated circuit 22 viathe first internal connecting terminal 15. The wiring pattern 17includes an external connecting terminal providing area 17A where theexternal connecting terminal 19 is provided. The thickness of the wiringpattern 17 can be, for example, approximately 5 μm through approximately20 μm.

The solder resist layer 18 is provided so as to cover the wiring pattern17. The solder resist layer 18 includes an opening part 18X configuredto expose the external connecting terminal providing area 17A (SMD andNSMD is available). As a material of the solder resist layer 18, resinwhose main ingredient is, for example, epoxy, epoxy acrylate, cyanateester, or siloxane, can be used.

The external connecting terminal 19 is provided on the externalconnecting terminal providing area 17A of the wiring pattern 17. Theexternal connecting terminal 19 is electrically connected to a padprovided on a mounting board (not illustrated in FIG. 12) such as amotherboard. As the external connecting terminal 19, for example, asolder bump or the like can be used. As materials of the externalconnecting terminals 19, for example, an alloy including Pb, an alloy ofSn and Cu, an alloy of Sn and Ag, an alloy of Sn, Ag, and Cu, and othermetals and alloys can be used. In addition, a solder ball (Sn—3.5 Ag)having a core made of resin such as divinylbenzene may be used for theexternal connecting terminal 19.

Although the external connecting terminal 19 is formed in thisembodiment, it is not always necessary to form the external connectingterminal 19. In other words, it is sufficient to expose the externalconnecting terminal providing area 17A so that the external connectingterminal 19 may be formed if necessary.

FIG. 13 through FIG. 28 are views showing an example of a manufacturingprocess of the semiconductor device of the first embodiment of thepresent invention. In FIG. 13 through FIG. 28, parts that are the sameas the parts of the semiconductor device 10 illustrated in FIG. 12 aregiven the same reference numerals, and explanation thereof may beomitted. In FIG. 13 through FIG. 15, “C” denotes a position (hereinafter“substrate cutting position C”) where the semiconductor substrate 21 iscut by a dicing blade. “A” denotes a semiconductor device forming area(hereinafter “semiconductor device forming area A”). “B” denotes ascribing area B, including the substrate cutting position C, where thesemiconductor device forming areas A are separated from each other(hereinafter “scribing area B”).

Furthermore, in FIG. 17 through FIG. 28, “F” denotes a position(hereinafter “substrate cutting position F”) where the semiconductorsubstrate 25 is cut by a dicing blade. “D” denotes plural semiconductorchip mounting areas (hereinafter “semiconductor chip mounting areas D”).“E” denotes a scribing area E, including the substrate cutting positionF, where the semiconductor chip mounting areas D are separated from eachother (hereinafter “scribing area E”).

First, in a step illustrated in FIG. 13, the semiconductor substrate 21is prepared. The semiconductor substrate 21 includes pluralsemiconductor device forming areas A and the scribing areas B includingthe substrate cutting positions C whereby plural semiconductor deviceforming areas A are separated from each other. As the semiconductorsubstrate 21, for example, an Si wafer or the like can be used. Thethickness of the semiconductor substrate 21 can be, for example,approximately 500 μm through approximately 775 μm.

Next, in a step illustrated in FIG. 14, by a known method, pluralsemiconductor chips 11 are formed at a surface of the semiconductorsubstrate 21 corresponding to the semiconductor device forming area A.The semiconductor chips 11 include the semiconductor integrated circuits22, the electrode pads 23, and the protection films 24. As a material ofthe electrode pad 23, for example, Al or the like can be used. As thematerial of the electrode pad 23, a material where an Al layer is formedon a Cu layer, a material where an Al layer is formed on a Si layerformed on a Cu layer or the like may be used. As the protection film 24,for example, an SiN film, a PSG film, or the like can be used. Inaddition, a polyimide film or the like may be further stacked on the SiNfilm, the PSG film, or the like.

Next, in a step illustrated in FIG. 15, the semiconductor substrate 21is ground from the rear surface side of the semiconductor substrate 21so that the semiconductor substrate 21 has a thin plate-shapedconfiguration. In addition, the fixing layer 13 is formed on the rearsurface of the thin plate-shaped semiconductor substrate 21. A back sidegrinder, for example, can be used for making the thin plate-shapedconfiguration of the semiconductor substrate 21. The thickness T₁ of thethinned semiconductor substrate 21 can be, for example, approximately 50μm through approximately 100 μm. As the material of the fixing layer 13,for example, a double-faced pressure-sensitive adhesive tape such as adie attaché film can be used. In addition, instead of the double-facedpressure-sensitive adhesive tape such as the die attaché film, anadhesive or the like having electrical insulation may be used. Thethickness of the fixing layer 13 can be, for example, approximately 10μm.

Next, in a step illustrated in FIG. 16, the protection film 24 and thesemiconductor substrate 21 at a portion corresponding to the scribingarea B illustrated in FIG. 15 is cut along the substrate cuttingposition, so that plural pieces of the semiconductor chips 11 are made.The protection film 24 and the semiconductor substrate 21 can be cut bya blade dicing method or the like using, for example, a dicing bladewhose width is less than the width of the scribing area B. In the piecesof the semiconductor chips 11, the fixing layer 13 is formed on the rearsurface of the semiconductor substrate 21.

Next, in a step illustrated in FIG. 17, the semiconductor substrate 25is prepared. The semiconductor substrate 25 includes pluralsemiconductor chip mounting areas D and the scribing areas E includingthe substrate cutting positions F where plural semiconductor chipmounting areas D are separated from each other. The semiconductor chipmounting area D is an area where the semiconductor chip 11 (see FIG. 16)is mounted. Accordingly, an area in the plan view of FIG. 17 of thesemiconductor chip mounting area D is larger than an area in plan viewof the semiconductor chip 11. As the semiconductor substrate 25, forexample, an Si wafer or the like can be used. The thickness of thesemiconductor substrate 25 can be, for example, approximately 500 μmthrough approximately 775 μm.

Next, in a step illustrated in FIG. 18, by a known method, the electrodepad 26 and the protection film 27 are formed at the surface of thesemiconductor substrate 25 corresponding to the semiconductor chipmounting area D so that the supporting board 14 is manufactured. As amaterial of the electrode pad 26, for example, Al or the like can beused. As the material of the electrode pad 26, a material where an Allayer is formed on a Cu layer, a material where an Al layer is formed ona Si layer formed on a Cu layer or the like may be used. As theprotection film 27, for example, an SiN film, a PSG film, or the likecan be used. In addition, a polyimide film or the like may be furtherstacked on the SiN film, the PSG film, or the like. In this step, thesemiconductor integrated circuit may be formed on the semiconductorsubstrate 25 of the supporting board 14.

Next, in a step illustrated in FIG. 19, one of the semiconductor chips11 illustrated in FIG. 16 is mounted on an inside of an area where theelectrode pads 26 are formed in each of the semiconductor chip mountingareas D of the supporting board 14 illustrated in FIG. 18. Since thefixing layer 13 is formed on the rear surface of the semiconductor chip11, the semiconductor chip 11 is fixed on the supporting board 14 viathe fixing layer 13.

Next, in a step illustrated in FIG. 20, the first internal connectingterminals 15 and the second internal connecting terminals 12 are formedon the electrode pads 23 and 26, respectively. As the first internalconnecting terminal 13 and the second internal connecting terminal 12,for example, an Au bump, a Cu bump, an Au plating film, a metal filmformed by a Ni film formed by an electroless plating method and an Aufilm covering the Ni film, or the like can be used. The Au bump or theCu bump can be formed by a bonding wire by using, for example, a wirebonding apparatus. In addition, the Au bump or the Cu bump can be formedby using a plating method.

Next, in a step illustrated in FIG. 21, the insulation layer 16 isformed on the supporting board 14 so as to cover the semiconductor chip11, the first internal connecting terminals 15, and the second internalconnecting terminals 12. As a material of the insulation layer 16, forexample, sheet insulation resin having adhesion properties in a B-stage(semi-cured state) such as NCF (Non-Conductive Film), paste insulationresin such as NCP (Non Conductive Paste), sheet anisotropic conductiveresin having adhesion properties such as ACF (Anisotropic ConductiveFilm), paste anisotropic conductive resin such as ACP (AnisotropicConductive Paste), built-up resin such as epoxy resin includinginorganic filler or epoxy resin excluding the inorganic filler, a liquidcrystal polymer, or the like can be used.

In a case where the sheet insulation resin having adhesion properties orthe anisotropic conductive resin is used as the insulation layer 16, thesheet insulation resin having adhesion properties or the anisotropicconductive resin is adhered to a surface of the structural bodyillustrated in FIG. 20 so that the insulation layer 16 is formed. Inaddition, in a case where the paste insulation resin or the anisotropicconductive resin is used as the insulation layer 16, the pasteinsulation resin or the anisotropic conductive resin is formed at thesurface of the structural body illustrated in FIG. 20 by a printingmethod, and then pre-baking is performed so that the insulation resin orthe anisotropic conductive resin is semi-cured. The semi-curedinsulation resin or the anisotropic conductive resin has adhesionproperties.

Next, in a step illustrated in FIG. 22, the insulation layer 16 ispressed from the surface 16A side of the insulation layer 16 in an arrowdirection of FIG. 22 while the structural body illustrated in FIG. 21 isheated. As a result of this, the surfaces of the structural bodyillustrated in FIG. 20 (more specifically, the surface 16A of theinsulation layer 16, the surfaces 15A of the first internal connectingterminals 15, and the surfaces 12A of the second internal connectingterminals 12) become flat. In other words, a flattening process for thesurface 16A of the insulation layer 16, the surfaces 15A of the firstinternal connecting terminals 15, and the surfaces 12A of the secondinternal connecting terminals 12 can be performed at the same time in abatch.

In addition, by heating the structural body illustrated in FIG. 22 at atemperature higher than a temperature at the time of pressing. (at acuring temperature of the insulation layer 16), the insulation layer 16is cured. The thickness of the insulation layer after pressing can be,for example, approximately 80 μm through approximately 160 μm. Theheight H₁ of the first internal connecting terminal 15 can be, forexample, approximately 20 μm through approximately 50 μm. The height H₂of the second internal connecting terminal 12 can be, for example,approximately 80 μm through approximately 160 μm. In this state, a partof material forming the insulation layer 16 is adhered to the surfaces15A of the first internal connecting terminals 15 and the surfaces 12Aof the second internal connecting terminals 12. Hence, the surfaces 15Aof the first internal connecting terminals 15 and the surfaces 12A ofthe second internal connecting terminals 12 are not completely exposedfrom the insulation layer 16.

Next, in a step illustrated in FIG. 23, an ashing process is applied tothe surface 16A of the insulation layer 16, so that the surfaces 15A ofthe first internal connecting terminals 15 and the surfaces 12A of thesecond internal connecting terminals 12 are completely exposed from theinsulation layer 16 and the surface 16A of the insulation layer 16 isroughened. In the ashing process, for example, O₂ plasma ashing or thelike can be used.

Various kinds of inert gas, if necessary, may be added to oxygen gas tobe supplied. As the inert gas, for example, argon group gas, hydrogengroup gas, nitrogen group gas, CF group gas such as CF₄ or C₂F₆, or thelike can be used. Although ozone ashing or the like, instead of the O₂plasma ashing, may be performed, in the case of the ozone ashing, asufficient etching characteristic may not be obtained depending on thematerial of the insulation layer 16 or the etching rate may be degraded,compared to the O₂ plasma ashing, so that the productivity may bedegraded.

A surface where the ashing process is applied is roughened so thatminute concavities and convexities are formed on the surface. Byroughening the surface 16A of the insulation layer 16 in the stepillustrated in FIG. 23, it is possible to heighten the adhesioncapabilities with the first metal layer 28 to be formed on the surface16A of the insulation layer 16 in a step illustrated in FIG. 24. Inaddition, it is possible to heighten the adhesion capabilities with thesolder resist layer 18 to be formed in a step illustrated in FIG. 25.

Next, in the step illustrated in FIG. 24, the wiring pattern 17 isformed on the surface 16A of the insulation layer 16 by, for example, asemi-additive process. More specifically, first, the first metal layer28 is formed on the surface 16A of the insulation layer 16 by anelectroless plating method or a sputtering method. As the first metallayer 28, a layered product where, for example, a Ti film and a Cu filmare stacked in this order, a layered product where a Cr film and a Cufilm are stacked in this order, a single layer structural body of a Cufilm, or the like can be used. The thickness of the first metal layer 28can be, for example, approximately 1 μm. Next, a resist layer (notillustrated in FIG. 24) having an opening part corresponding to thewiring pattern 17 is formed on the first metal layer 28.

Next, by an electrolytic plating method where the first metal layer 28is used as a feeding layer, the second metal layer 29 is formed in theopening parts of the resist layer. As a material of the second metallayer 29, for example, Cu or the like can be used. The thickness of thesecond metal layer can be, for example, approximately 10 μm. After theresist layer is removed, portions of the first metal layer 28 notcovered with the second metal layer 29 are removed by an etching processusing the second metal layer 29 as a mask. As a result of this, thewiring pattern 17 including the first metal layer 28 and the secondmetal layer 29 is formed on the surface 16A of the insulation layer 16.The wiring pattern 17 can be formed by various kinds of the wiringforming methods such as a subtractive method, in addition to thesemi-additive method.

After that, a roughening process of the wiring pattern 17 is performed.The roughening process of the wiring pattern 17 can be performed byeither a blacking process or a roughening etching process. By theroughening process, it is possible to improve adhesion ability betweenthe wiring pattern 17 and the solder resist layer 18 to be formed on theupper surface and the side surface of the wiring pattern 17.

Next, in the step illustrated in FIG. 25, the resist is applied so as tocover the insulation layer 16 and the wiring pattern 17. Then, theresist is exposed and developed by a photolithography method. The resistat a portion corresponding to the external connecting terminal providingarea 17A is removed by etching. As a result of this, the solder resistlayer 18 having an opening part 18X configured to expose the externalconnecting terminal providing area 17A is formed. As the material of thesolder resist layer 18, resin whose main ingredient is, for example,epoxy, epoxy acrylate, cyanate ester, or siloxane, can be used.

Next, in a step illustrated in FIG. 26, the semiconductor substrate 25is ground from the rear surface side of the semiconductor substrate 25so that the semiconductor substrate 25 has a thin plate-shapedconfiguration. A back side grinder, for example, can be used for makingthe thin plate-shaped configuration of the semiconductor substrate 25.The thickness T₂ of the semiconductor substrate 25 can be, for example,approximately 200 μm through approximately 500 μm. The step illustratedin FIG. 26 may be omitted.

Next, in a step illustrated in FIG. 27, the external connectingterminals 19 are formed on the external connecting terminal providingareas 17A of the wiring patterns 17. As the external connecting terminal19, for example, a solder bump or the like can be used. As materials ofthe external connecting terminals 19, for example, an alloy includingPb, an alloy of Sn and Cu, an alloy of Sn and Ag, an alloy of Sn, Ag,and Cu, and other metals and alloys can be used. In addition, a solderball (Sn—3.5 Ag) having a core made of resin such as divinylbenzene maybe used for the external connecting terminal 19.

Although the external connecting terminals 19 are formed in thisembodiment, it is not always necessary to form the external connectingterminals 19. In other words, it is sufficient to expose the externalconnecting terminal providing areas 17A so that the external connectingterminals 19 may be formed if necessary.

As a result of this, a structural body, corresponding to pluralsemiconductor devices 10 having the so-called fan-out structure wherethe semiconductor chip 11 is mounted, is formed. The step illustrated inFIG. 27 may be performed before the step illustrated in FIG. 26. In thiscase, a back grind tape, which can accept the height of the externalconnecting terminal 19, is formed and the rear surface of thesemiconductor substrate 25 can be ground by this back grind tape.

Next, in a step illustrated in FIG. 28, the solder resist layer 18, theinsulation layer 16, the protection film 24 and the semiconductorsubstrate 25 of a portion corresponding to the scribing area E are cutin the substrate cutting position F, and thereby pieces of pluralsemiconductor devices 10 are manufactured. The semiconductor substrate25 and other parts can be cut by, for example, a blade dicing method orthe like using the dicing blade 44 having a width less than the width ofthe scribing area E.

Thus, according to the manufacturing method of the semiconductor device10 of the first embodiment of the present invention, an electrode pad isformed at an external edge part of a semiconductor chip mounting area ofa supporting board, the supporting board having a main surface where thesemiconductor chip mounting area is provided. A rear surface of asemiconductor chip having a main surface, the main surface being wherean electrode pad is formed, is fixed to an inside of an area of the mainsurface of the supporting board, the area being where the electrode padis formed. Then, a first internal connecting terminal is formed on theelectrode pad provided on the main surface of the supporting board, anda second internal connecting terminal is formed on the electrode padprovided on the main surface of the semiconductor chip. In addition, aninsulation layer is formed on the main surface of the supporting boardso as to cover the semiconductor chip and expose parts of the firstinternal connecting terminal and the second internal connectingterminal. In addition, a wiring pattern including wiring configured toelectrically connect the first internal connecting terminal and thesecond internal connecting terminal to each other is formed on theinsulation layer. In addition, a solder resist layer having an openingpart, the opening part being configured to expose an external connectingterminal providing area of the wiring pattern is formed so as to coverthe wiring pattern formed on the insulation layer. The opening part isarranged in an area including a portion outside the area where thesecond internal connecting terminal is formed. In addition, an outsideconnecting terminal may be formed in the external connecting terminalproviding area exposed in the opening part. Thus, since the opening partof the solder resist layer is arranged in an area including a portionoutside the area where the second internal connecting terminal isformed, it is possible to realize a semiconductor device which can havethe so-called fan-out structure by forming the external connectingterminal in the external connecting terminal providing area exposed inthe opening part.

In addition, by covering the first internal connecting terminal and thesecond internal connecting terminal by a single insulation layer, it ispossible to prevent a partial stress from being applied to the firstinternal connecting terminal and the second internal connectingterminal. Hence, it is possible to prevent cracks from being generatedat the first internal connecting terminal and the second internalconnecting terminal.

Second Embodiment

FIG. 29 is a cross-sectional view of an example of a semiconductordevice of a second embodiment of the present invention. In asemiconductor device 30 illustrated in FIG. 29, parts that are the sameas the parts of the semiconductor device 10 illustrated in FIG. 12 aregiven the same reference numerals, and explanation thereof may beomitted. As illustrated in FIG. 29, the semiconductor device 30 of thesecond embodiment has the same structure as that of the semiconductordevice 10 except that the semiconductor device 30 includes a notch part36X where a resin layer 37X is formed. In the following explanation,details of portions the same as those of the semiconductor device 10 areomitted but portions different from the portions of the semiconductordevice 10 are mainly discussed.

The notch part 36X and the resin layer 37X are formed at external edgeparts of the semiconductor substrate 25, the protection film 27, and theinsulation layer 16. In a case where, for example, the semiconductordevice 10 has a rectangular configuration in a planar view, the notchpart 36 is formed at the external edge parts of the semiconductorsubstrate 25, the protection film 27, and the insulation layer 16 in aframe shape. The width of the notch part 36X is less than the width (forexample, approximately 30 μm through approximately 200 μm) of thescribing area B. The depth D₁ of the notch part 36X where the mainsurface of the semiconductor chip 11 is a standard surface can be, forexample, approximately 5 μm through approximately 30 μm. Minuteconcavities and convexities (not illustrated in FIG. 29) are formed atthe surface of the notch part 36X.

As a material of the resin layer 37X, it is preferable to use lowelasticity resin (resin having an elasticity rate of, for example,approximately 20 MPa through approximately 100 MPa). As the material ofthe resin layer 37X, for example, epoxy group or polyimide groupinsulation resin, epoxy group or polyimide group anisotropic conductiveresin, or the like can be used. By using the low elasticity resin (resinhaving an elasticity rate of, for example, approximately 20 MPa throughapproximately 100 MPa) as the material of the resin layer 37X, it ispossible to have good adhesion properties with silicon. The thickness T₄of the resin layer 37X can be, for example, approximately 15 μm throughapproximately 40 μm.

In the semiconductor device 10 of the first embodiment, the insulationlayer 16 may be detached from the protection film 27 based on badadhesion properties with the insulation layer 16 formed on theprotection film 27 of the supporting board 14 and the protection film27. On the other hand, in the semiconductor device 30 of the secondembodiment, the notch part 36X is provided at the external edge part ofthe semiconductor substrate 25, the protection film 27, and theinsulation layer 16. The resin layer 37X is formed in the notch part36X. Therefore, an interface of the protection film 27 and theinsulation layer 16 is not exposed to an outside of the semiconductordevice 30. Therefore, the insulation layer 16 does not become detachedfrom the protection film 27.

In addition, since minute concavities and convexities (see FIG. 32) areformed at the surface of the notch part 36X, the resin layer 37X isengaged with the minute concavities and convexities formed at thesurface of the notch part 36X. Therefore, a so-called anchor effect isgenerated between the resin layer 37X and the notch part 36X so that theadhesion properties between the resin layer 37X and the notch part 36Xare improved. Accordingly, the interface between the semiconductorsubstrate 25 and the resin layer 37X is maintained.

FIG. 30 through FIG. 35 are views showing an example of a manufacturingprocess of the semiconductor device of the second embodiment of thepresent invention. In FIG. 30 through FIG. 35, parts that are the sameas the parts of the semiconductor device 30 illustrated in FIG. 29 aregiven the same reference numerals, and explanation thereof may beomitted. With reference to FIG. 30 through FIG. 35, a manufacturingmethod of the semiconductor device 30 of the second embodiment of thepresent invention is discussed.

First, processes the same as steps illustrated in FIG. 13 through FIG.18 and discussed in the first embodiment are performed. Next, in a stepillustrated in FIG. 30, resist is applied on the electrode pad 26 andthe protection film 27. Then, by exposing and developing the resist, theresist film 35 is formed on the parts of the electrode pad 26 and theprotection film 27 excluding the scribing area E. Although the resistfilm 35 works as a mask in a blasting process in steps illustrated inFIG. 31 and FIG. 32, a portion of the surface of the resist film 35 isalso shaved by the blasting process. Therefore, the thickness of theresist film 35 is formed so that the resist film 35 can be used as amask in the blasting process even if the portion of the surface of theresist film 35 is also shaved by the blasting process. The thickness ofthe resist film 35 can be, for example, approximately 50 μm.

Next, in steps illustrated in FIG. 31 and FIG. 32, the blasting processis performed by using the resist film 35 as the mask, so that parts ofthe protection film 27 and the semiconductor substrate 25 in thescribing area E are removed and a groove part 36 is formed in thescribing area E. The groove part 36 has, for example, a U-shapedconfiguration. The groove part 36 is finally cut down in the vicinity ofthe center so that the notch part 36X is formed. Here, FIG. 32 is anexpanded view of the vicinity of the groove part 36 illustrated in FIG.31. The width of the groove part 36 is substantially the same as thewidth (for example, approximately 30 μm through approximately 200 μm) ofthe scribing area E. The depth D₁ of the groove part 36 where the mainsurface of the semiconductor chip 11 is a standard surface can be, forexample, approximately 5 μm through approximately 30 μm. The surface ofthe groove part 36 formed by the blasting process is roughened so thatthe minute concavities and convexities illustrated in FIG. 32 areformed.

Here, the blasting process is a process where a polishing agent is blownonto a process subject with a high pressure so that surface roughness ofthe process subject is mechanically controlled. Blasting processesincludes a dry blasting process, a sand blasting process, a wet blastingprocess, and other processes. Especially, it is preferable to use thewet blasting process where the polishing agent such as alumina abrasivegrain or spherical silica abrasive grain is diffused in a solvent suchas water so as to collide with a surface of the process subject, so thata minute area is ground. This is because if the wet blasting process isused, compared to the dry blasting process, it is possible to performgrinding with extremely high accuracy and little damage. Furthermore, inthe wet blasting process unlike the dry blasting process, since thepolishing agent is diffused in the solvent such as water, the polishingagent does not fly in the air as dust. In addition, since the solventsuch as water cleans the polishing agent in the process, it is possibleto inhibit the residual of the polishing agent at the surface of theprocess subject.

A grain diameter of the polishing agent, such as alumina abrasive grainor spherical silica abrasive grain, used for the wet blasting process,can be, for example, approximately 5 μm through approximately 20 μm. Theconcentration of the polishing agent, such as alumina abrasive grain orspherical silica abrasive grain, diffused in the solvent such as watercan be, for example, approximately 14 vol %. In addition, an injectingpressure at the time when the polishing agent diffused in the solventsuch as water is injected onto the surface of the process subject maybe, for example approximately 0.25 MPa.

Next, in steps illustrated in FIG. 33, by using the resist film 35 as amask, liquid or paste resin is supplied to the groove part 36 by aprinting method or the like and then the resin layer 37 (semi-cured) isformed. The resin layer 37 is finally cut down in the vicinity of thecenter so that the resin layer 37X is formed. The thickness T₄ of theresin layer 37 can be, for example, approximately 15 μm throughapproximately 40 μm. As a material of the resin layer 37, it ispreferable to use low elasticity resin (resin having an elasticity rateof, for example, approximately 20 MPa through approximately 100 MPa). Asthe material of the resin layer 37, for example, paste epoxy group orpolyimide group insulation resin such as NCP (Non Conductive Paste),paste epoxy group or polyimide group anisotropic conductive resin suchas ACP (Anisotropic Conductive Paste), or the like can be used. By usingthe low elasticity resin (resin having an elastic rate of, for example,approximately 20 MPa through approximately 100 MPa) as the material ofthe resin layer 37X, it is possible to have good adhesion propertieswith silicon.

Next, in a step illustrated in FIG. 34, after the resin layer 34 iscured, the resist film 35 illustrated in FIG. 33 is removed. The resinlayer 37 can be cured by heating at, for example approximately 180° C.for approximately 1 hour through 2 hours. The heating may be performedunder a nitrogen atmosphere.

Next, the same process as the steps illustrated in FIG. 19 through FIG.27 discussed in the first embodiment is performed. Then, in a stepillustrated in FIG. 35, the solder resist layer 18, the insulation layer16, the resin layer 37 and the semiconductor substrate 25 of a portioncorresponding to the scribing area E are cut in the substrate cuttingposition F, and thereby plural semiconductor devices 30 aremanufactured. The semiconductor substrate 25 and other parts can be cutby, for example, a blade dicing method or the like using the dicingblade having a width less than the width of the scribing area E.

Thus, according to the second embodiment of the present invention, thesame effect as the first embodiment can be achieved and the followingeffect can be further achieved. In other words, the notch part 36X isprovided at the external edge part of the semiconductor substrate 25,the protection film 27, and the insulation layer 16. The resin layer 37Xis formed in the notch part 36X. Therefore, an interface of theprotection film 27 and the insulation layer 16 is not exposed to anoutside of the semiconductor device 30. Therefore, the detachment of theinterface of the insulation layer 16 and the protection film 27 can beprevented. It may be preferable to use the low elasticity resin (resinhaving an elasticity rate of, for example, approximately 20 MPa throughapproximately 100 MPa) as the material of the resin layer 37X.

Third Embodiment

In the third embodiment of the present invention, the steps illustratedin FIG. 22 and FIG. 23 in the first embodiment are replaced with stepsillustrated in FIG. 36 through FIG. 38.

FIG. 36 through FIG. 38 are views showing an example of a manufacturingprocess of the semiconductor device of the third embodiment of thepresent invention. In FIG. 36 through FIG. 38, parts that are the sameas the parts illustrated in FIG. 22 and FIG. 23 are given the samereference numerals, and explanation thereof may be omitted.

First, the same steps as the steps illustrated in FIG. 13 through FIG.21 are performed. Next, in a step illustrated in FIG. 36, a plate-shapedbody 49 is provided on the surface 16A of the insulation layer 16. Asurface 49B of the plate shape body 49 facing the surface 16A of theinsulation layer 16 is a roughened surface. The thickness of theplate-shaped body 49 can be, for example, approximately 10 μm. As theplate-shaped body 49, for example, a metal foil such as Cu foil can beused. In addition, as the plate-shaped body 49, a temporary film made ofPET or the like may be used. Furthermore, as the plate-shaped body 49, aresin film where a copper foil is formed on a single surface of theresin film may be used. In the following explanation, an example wherethe metal foil is used as the plate-shaped body 49 is discussed.

Next, in a step illustrated in FIG. 37, in a state where the structuralbody illustrated in FIG. 36 is heated, the plate-shaped body 49 ispressed from the surface 49A side of the plate-shaped body 49 so thatthe plate-shaped body 49 is press-fixed to the insulation layer 16. As aresult of this, the insulation layer 16 is pressed so that the surface15A of the first internal connecting terminal 15 and the surface 12A ofthe second internal connecting terminal 12 are exposed from the surface16A of the insulation layer 16. In addition, the roughness of aroughened surface 49B of the plate-shaped body 49 is transferred to thesurface 16A of the insulation layer 16. By heating the structural bodyillustrated in FIG. 37, the insulation layer 16 is cured. The thicknessof the insulation layer 16 after press-fixing may be, for example,approximately 80 μm through approximately 160 μm.

Next, in a step illustrated in FIG. 38, the entire plate-shaped body 49illustrated in FIG. 37 is removed by etching. Since the roughness of theroughened surface 49B of the plate-shaped body 49 is transferred in thesteps illustrated in FIG. 36 through FIG. 38, the surface 16A of theinsulation layer 16 is roughened so that the minute concavities andconvexities are formed. By roughening the surface 16A of the insulationlayer 16 in the step illustrated in FIG. 24, it is possible to heightenthe adhesion properties with the first metal layer 28 formed on thesurface 16A of the insulation layer 16. In addition, it is possible toheighten the adhesion properties between the surface 16A of theinsulation layer 16 and the solder resist layer 18 formed in the stepillustrated in FIG. 25.

Next, the same processes as the steps illustrated in FIG. 24 throughFIG. 28 discussed in the first embodiment are performed so that pluralsemiconductor devices 10 are manufactured.

Thus, according to the third embodiment of the present invention, it ispossible to achieve the same effect as that of the first embodiment. Inaddition, the third embodiment can be combined with the secondembodiment.

All examples and conditional language recited herein are intended forpedagogical purposes to aid the reader in understanding the inventionand the concepts contributed by the inventor to furthering the art, andare to be construed as being without limitation to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority orinferiority of the invention. Although the embodiments of the presentinvention have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

For example, in the step illustrated in FIG. 13, The semiconductorsubstrate 21 including plural semiconductor device forming areas A andthe scribing areas B including the substrate cutting positions C wherebyplural semiconductor device forming areas A are separated from eachother is used. However, it is not always necessary that pluralsemiconductor chips are formed at the semiconductor substrate. Only asingle semiconductor chip may be formed at a single semiconductorsubstrate.

In addition, in the first embodiment through the third embodiment, asingle layer of the wiring pattern is provided. However, the presentinvention is not limited to this. The wiring pattern may have amultilayer structure. By providing a multilayer structure wiringpattern, it is possible to use a semiconductor chip having a highdensity design.

Thus, according to the embodiments of the present invention, it ispossible to provide a semiconductor device having the so-called fan-outstructure.

1. A semiconductor device, comprising: a supporting board having aprotection film and a first electrode pad thereon; a semiconductor chipprovided on the supporting board and having a second electrode pad; afirst internal connecting terminal formed on the first electrode pad ofthe supporting board outside of the semiconductor chip; a secondinternal connecting terminal formed on the second electrode pad of thesemiconductor chip and having a top surface on a same plane as that ofthe first internal connecting terminal; a first insulation layerprovided on the supporting board so as to cover the semiconductor chip,and the first and second internal connecting terminals; a wiring patternprovided on the first insulation layer, said wiring pattern connectingthe first and second internal connecting terminals; a solder resistlayer provided on the first insulation layer and the wiring pattern,said solder resist layer having an opening part; an external connectingterminal provided so as to connect to the wiring pattern through theopening part; a groove part provided so as to penetrate the protectionfilm in a thickness direction thereof and formed in parts of thesupporting board and the first insulation layer, the groove part beingformed at lateral peripheries of the supporting board, the protectionfilm, and the first insulation layer; and a resin layer formed in thegroove part.
 2. The semiconductor device as claimed in claim 1, whereinthe resin layer is formed of a low elasticity resin having an elasticityranging from 20 MPa to 100 MPa.
 3. The semiconductor device as claimedin claim 1, wherein the groove part is formed at a plurality ofsemiconductor chip mounting areas and a scribing area of the supportingboard including a substrate cutting position in which the plurality ofsemiconductor chip mounting areas are separated, and wherein the firstinternal connecting terminal is positioned between an outer periphery ofthe semiconductor device and the semiconductor chip.
 4. Thesemiconductor device as claimed in claim 1, wherein the groove part hasminute concavities and convexities on a surface thereof.
 5. Thesemiconductor device as claimed in claim 1, wherein the first insulationlayer has a roughened surface on a top surface thereof.
 6. Thesemiconductor device as claimed in claim 1, wherein the wiring patternhas a roughened surface.